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陶瓷基板导热系数高,倒装芯片,金锡共晶,热电分离设计,可大电流驱动
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TH采用陶瓷基板导热系数高,特殊共晶技术使其具有低热阻的特性,散热性能良好,可靠性高;焊盘采用热电分离设计,可大电流驱动。独特的光学透镜,朗伯形貌发光,使得客户更容易进行二次配光。
蓝宝石倒装芯片,荧光膜片工艺,特殊设计光学透镜封装。
陶瓷封装,高亮度,高光效
尺寸:3.5mmx3.5mmx2.3mm
根据ANSI 标准分档
适于SMT 贴片
发光角度:120°
包装:最大1000 颗/卷
电性参数: (T solder pad =85 ℃,IF=700mA) | ||||||||||
常规色温/K | 典型显指 | 亮度等级 / 最小光通量 (lm) | ||||||||
HB | JB | KB | MB | NB | PB | QB | RB | SB | ||
190 | 210 | 230 | 250 | 270 | 290 | 310 | 330 | 350 | ||
6500 | 70 | ● | ● | ● | ||||||
5700 | 70 | ● | ● | ● | ||||||
5000 | 70 | ● | ● | ● | ||||||
4000 | 70 | ● | ● | |||||||
3500 | 70 | ● | ● | ● | ||||||
3000 | 70 | ● | ● | ● | ||||||
2700 | 70 | ● | ● | ● | ||||||
6500 | 80 | ● | ● | ● | ||||||
5700 | 80 | ● | ● | ● | ||||||
5000 | 80 | ● | ● | ● | ||||||
4000 | 80 | ● | ● | ● | ||||||
3500 | 80 | ● | ● | ● | ||||||
3000 | 80 | ● | ● | ● | ||||||
2700 | 80 | ● | ● | ● | ||||||
6500 | 90 | ● | ● | |||||||
5700 | 90 | ● | ● | ● | ||||||
5000 | 90 | ● | ● | ● | ||||||
4000 | 90 | ● | ● | ● | ||||||
3500 | 90 | ● | ● | ● | ||||||
3000 | 90 | ● | ● | |||||||
2700 | 90 | ● | ● | |||||||
4000 | 95 | ● | ● | |||||||
3500 | 95 | ● | ● | ● | ||||||
3000 | 95 | ● | ● | |||||||
2700 | 95 | ● | ● |
路灯
隧道灯
工矿灯
规格书:
LBQ3-70-80_074 TH(TG3)_Data Sheet A04.pdf
CAD(3D):
TF3&TG3&TK&TH&KH&TF-Blue&TH-Blue 3D.zip
光学文件链接:
https://pan.baidu.com/s/1XGkgx8v-sDmQZvHDaO-aIw?pwd=h9ei
提取码:h9ei
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